Improved Pickup Offset
The rotary holder has been redsigned, enabling a unique Y-axis pick-up position offset function. As a result, pick-up of extremely small chips is stable. (Patent pending)

0402(01005) Chip Support
Placement of 0402(01005) chips does not require any major modifications. The narrow camera lens is simply replaced with a high resolution lens.

Lighting
The system offers excellent versatility to change between background and foreground lighting, enabling sharp imaging of part outlines and leads on parts such as J-lead PLCC. Sidelighting for CSP and BGA bump recognition employs LED, enabling recognition of wafer level CSP chips.

UV LED
The light source for vision processing has been changed from halogen and UV lamps to LED and UV LED, resulting in stable vision processing and simpler maintenance.

Windmill-type Nozzles
Because the nozzle is parallel with the axis of rotation, center positioning is extremely accurate, contributing to high placing accuracy.

Two Camera System
The machine is equipped with two cameras, a high resolution narrow view camera for very small parts such as 0603(0201), 1005(0401), or SMIN, and a wide view camera for large parts such as SOIC and PLCC.

High-speed Board Loading
Carrier conveyance achieves a board load time of 1.4 seconds. This high speed is particularly advantageous when producing boards with relatively few placements, and leads to increased productivity.

PCB Support
Shock absorbing back-up support is available for accurate placement of small chips.

Feeder Verification
Fujitrax Verifier and barcode sensors maximize verification functions. The system automatically recognizes feeders, preventing part setup mistakes and simplifying changeover.
